The Applied Centura Enabler Etch is a state-of-the-art etch chamber designed for high-volume production environment complimenting today’s technologically challenging approach of all-in-one process integration. Enabler is equally suited for front end and back end applications. The unique design results in a versatile, highly controllable chamber architecture with the widest operating window available for processing advanced BEOL dual damascene low-k integration schemes and >30:1 aspect ratio contact structures for FEOL.

Learn more about the etch component of the copper interconnect sequence.

Enabler’s exceptional process capability derives from a patented high-frequency source for plasma density generation that is fully decoupled from ion energy and ion energy distribution. The distinctive source enables the chamber to operate in either a low dissociation, high selectivity mode needed for ultra thin photoresists or a high dissociation mode required for effective and efficient removal of photoresist, post-etch residues and for chamber cleaning. Ion flux and neutral species distribution are independently tunable to provide optimum etch rate, CD uniformity and ultra-precise on-wafer performance. Enabler performs all the steps in a complex integration scheme (i.e., mask open, via, trench, resist strip and residue removal, barrier open) in a single chamber. The resulting stable and repeatable etch performance is due to superior plasma stability over a large pressure/flow operating window spanning ultra-low (<10mT) to Torr-level pressures. The Enabler operates with plasma-on from step to step eliminating plasma re-ignition steps resulting in substantial savings in costs and cycle time.

Efficient clean capability and high-purity plasma resistant chamber materials combine to produce ultra-stable Clean Mode chamber conditions and world-class particle performance. These, in turn, ensure lot-to-lot repeatability in volume production environment and result in the lowest cost of consumables among commercial etch products.

Enabler’s unique design and process flexibility, productive and low operation cost makes it the ideal next-generation etch system for multiple integration schemes and advanced low-k films.